- Dual-arm transfer robot with external axis The dual-arm mechanism paired with an external axis overlaps pick-and-place motions and extends reachable positions, delivering high wafer transfer efficiency within a compact module.
- SEMI-compatible interface system Designed for compatibility with SEMI standards, aligning with common semiconductor automation expectations for interoperability and integration in fab ecosystems.
- Works with MR/OHT factory transport Transfers wafers manually or in coordination with automated material transport infrastructure such as Overhead Hoist Transport carrying levels, reducing manual handling in the fab.
- Small footprint front-end module Compact form factor conserves cleanroom floor space at the tool front end while still housing a high-efficiency dual-arm transfer mechanism.
- Contamination-controlled wafer hand-off Coordinates wafer loading, alignment, and hand-off in the front-end handling volume, supporting contamination control and reducing operator contact with critical substrates.
الوصف
The SIASUN TSS-3000 is an Equipment Front End Module (EFEM) — the controlled interface that sits between a wafer fab's material transport system and a process tool's internal transfer environment. SIASUN positions the TSS-3000 as a SEMI-compatible front-end wafer transfer device and interface system, built around a dual-arm transfer robot with an external axis. This configuration is used to overlap pick-and-place motions and extend the reachable positions within the module's working envelope, supporting high transfer efficiency while keeping a deliberately small footprint. In its front-end role, the module coordinates wafer loading, alignment, hand-off, and transfer, helping maintain contamination control and standardized equipment communication while reducing operator contact with critical substrates.
The TSS-3000 transfers wafers either manually or in coordination with automated factory transport at MR or OHT (Overhead Hoist Transport) carrying levels, allowing it to integrate into modern automated fab logistics rather than relying on manual carrier handling alone. Deployed at the tool front end, it bridges the factory interface where carriers arrive and depart, the front-end handling volume, and the process tool interface — providing standardized mechanical and software interfaces and repeatable wafer transfers for semiconductor wafer processing lines. Configuration-specific details such as supported wafer sizes, load port counts, accuracy, cycle time, and cleanroom class are confirmed per project as part of the quotation process.
الميزات
المواصفات
| Brand | SIASUN |
|---|---|
| Model | TSS-3000 |
| Type | Front-end wafer transfer device / interface system (EFEM) |
| Standards | Compatible with SEMI standards |
| Transfer Mechanism | Dual-arm robot with external axis |
| Handling Modes | Manual transfer or integrated with MR/OHT factory transport |
| Form Factor | Small footprint |
الصناعات
الأسئلة الشائعة
The TSS-3000 is an Equipment Front End Module — a front-end wafer transfer device and SEMI-compatible interface system from SIASUN. It sits at the front end of a semiconductor process tool and coordinates wafer loading, alignment, hand-off, and transfer between the fab's material transport system and the tool, using a dual-arm transfer robot with an external axis.
SIASUN states the TSS-3000 can transfer wafers manually or in conjunction with MR or OHT (Overhead Hoist Transport) carrying levels, meaning it is designed to work with automated factory material transport infrastructure. Its compatibility with SEMI standards supports interoperability and standardized equipment communication within fab ecosystems.
Details such as supported wafer sizes, load port counts, positioning accuracy, cycle time, and cleanroom class are model- and configuration-specific and are not published in the brief public catalog description. These are confirmed through the manufacturer datasheet and quotation for your specific tool and fab requirements — contact Robotix Market and we will assist with the technical clarification.
The SIASUN V-Series is a general-purpose industrial robot for factory automation tasks, whereas the TSS-3000 is a specialized semiconductor front-end module: a complete SEMI-compatible interface system with an integrated dual-arm wafer transfer robot, purpose-built for contamination-controlled wafer handling at the process tool front end.
The TSS-3000 is sold on a quotation basis through Robotix Market — submit an inquiry via our quote form and we will confirm pricing, configuration, lead time, and shipping for your region. The system is covered by SIASUN's manufacturer warranty; installation and on-site services are not included and integration is typically handled by the buyer's tool or fab integration team.
تمت مشاهدته مؤخراً
لم تشاهد أي منتجات بعد.
